NASA is Working on 3D Print Technology Circuits in Space

3D printing is an emerging technology with numerous potential applications. NASA explores 3D printing in space for circuits in microgravity, aiming to develop a method.

3D printing circuits in space offer several advantages, including reducing the need for expensive and time-consuming Earth-transportation of delicate electronic components, creating customized circuits for specific applications, and repairing damaged circuits in situ, saving time and resources.

NASA and academic engineers tested hybrid printed electronic circuits near the Kármán line in space. The Suborbital Technology Experiment Carrier-9 sounding rocket mission, launched on April 25, reached an altitude of 174 kilometers before descending via parachute.

In 2022, NASA and academia engineers tested hybrid printed electronic circuits near the Kármán line, near the edge of space. The tests were conducted on a parabolic flight, showcasing microgravity conditions. The results were promising, indicating a promising path toward 3D printing circuits in space.

NASA’s 3D printing technology could significantly impact future space missions by enabling astronauts to manufacture electronic components on-demand, reducing Earth’s need for supplies and making space exploration more efficient and cost-effective.

In addition, 3D printing circuits can create innovative space-based technologies, such as solar panels and sensors, enabling new opportunities for exploration and research in space. This technology could revolutionize the development of electronic devices for space exploration.

The development of 3D printing of circuits in space is still in its early stages, but the potential benefits are significant. If NASA is successful, this technology could revolutionize space exploration and make it possible to achieve new and exciting goals.

Here are some of the potential applications of 3D-printed circuits in space:

  • Repairing or replacing damaged circuits. This could be done in-situ, without the need to send replacement parts from Earth.
  • Creating custom-designed circuits. This could be used to optimize circuits for specific applications, such as radiation resistance or low power consumption.
  • Manufacturing electronic devices on-demand. This could reduce the need to ship supplies from Earth and make space exploration more efficient and cost-effective.

The SubTEC-9 mission tested 14 different types of technologies in addition to the 3D-printed electronic circuits. These include a faster telemetry link, a new antenna, a low-cost gyro, a new high-density battery, and a new smaller star tracker, which is a sensor designed to align an important object in space, such as a star, and is intended for altitude control systems.

The SubTEC missions are only a small part of NASA’s Sounding Rockets Programme (NSRP), which began in 1959 with the goal of providing space and earth science research activities. NSRP has launched approximately 3,000 missions to suborbital space over the last two decades, with a mission success rate of more than 90% and a launch success rate of 97 percent.

NASA and the University of Maryland’s LPS engineering team showcased their hybrid printed electronic circuits in a NASA Wallops Flight Facility laboratory before their SubTEC-9 technology test flight in April 2023. The curved metal plate showcased the printed electronics test assembly, marking the first flight of hybrid printed circuits into space.

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Conclusion:

The development of 3D printing of circuits in space is still in its early stages, but the potential benefits are significant. If NASA is successful, this technology could revolutionize space exploration and make it possible to achieve new and exciting goals.